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Blue Negative 16x2 Lcd Module , White LED Lcd Character Display Wide Viewing Angle
Product Details:
| Place of Origin: | Dongguan, China |
| Brand Name: | FangSheng |
| Certification: | ISO9001:2015 |
| Model Number: | FS1602G |
Payment & Shipping Terms:
| Minimum Order Quantity: | 500 |
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| Price: | Negotiation |
| Packaging Details: | Bubble bag + Blister + Foam box + Carton |
| Delivery Time: | 3-5 Working Days |
| Payment Terms: | T/T,Western Union, Paypal, D/A, D/P, L/C |
| Supply Ability: | 200K Sets / Month |
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Detail Information |
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| LCD Type: | COB | Polarizer Mode: | Transflective |
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| Display Mode: | Positive | Viewing Angle: | 6'clock |
| Storage Temp: | -20--+60℃ | Back Light: | White LED Backlight |
| High Light: | stn lcd module,monochrome lcd display module |
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Product Description
16 x 2 dot matrix Character STN LCD Display in STN Positive Gray LCD Mode
A 16x2 dot matrix Character LCD Module display in STN Negative Blue LCD Mode, Six O'clock viewing direction, Normal Temperature Range (Operating Temp: 0°C to 50°C, Storage Temp: -20°C to 60°C), and White LED Backlight. It has a transmissive polarizer suitable for darker environment. This product is assembled Chip On board with 1/16 Duty and a Controller IC S6A0069 or equivalent. The interface type is Parallel. This is an ROHS Compliant product manufactured with ISO standards and procedures.
Specifications
- Number of Characters: 16 characters x 2 Lines
- Character Table: English-European (RS in Datasheet)
- Module dimension: 80.0mm x 36.0mm x 13.2mm(MAX)
- View area: 66.0 x 16.0 mm
- Active area: 56.2 x 11.5 mm
- Dot size: 0.56 x 0.66 mm
- Dot pitch: 0.60 x 0.70 mm
- Character size: 2.96 x 5.46 mm
- Character pitch: 3.55 x 5.94 mm
- LCD type: STN, Negative, Transmissive, Blue
- Duty: 1/16
- View direction: Wide viewing angle
- Backlight Type: white LED
- RoHS Compliant: lead free
- Operating Temperature: -20°C to + 70°C
A chip-on-board is a chip that is wired directly to the motherboard. The chip is usually covered with a coating of epoxy or resin to protect it the way a heatsink does, as well as protecting the chips and wires from damage. This is where the term “glop-top” comes from. It is a cost-effective method of electronic packaging, but the disadvantage is that a chip cannot be replaced without desoldering, the way a socketed chip can. COBs are popular in small circuit boards because they require little physical space the way a heatsink does.
